Precise positioning stage of THK PRECISION

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  • Product Application Examples

SAMPLE

  • Laser / optics related equipment, optical alignment

    • Mirror fine-tuning of interferometer

      Mirror fine-tuning of interferometer

      Mirrors can be controlled with high precision to a fineness of several hundredths of a wavelength, and optical systems using interference can also be measured stably.

    • Transmission optical elements alignment

      Transmission optical elements alignment

      Openings can be easily provided even in a small body, making it suitable for positioning optical devices that transmit laser light, etc.

    • Optical fiber optical axis adjustment

      Optical fiber optical axis adjustment

      Optical fibers can be aligned with high accuracy and high speed in the XYZ axis, making it easy to find the peak point of incoming light.

    • Mirror scanning for laser machining

      Mirror scanning for laser machining

      Designs with water-cooled flow paths are also available to suppress heat generation in the reflecting mirror due to high-power lasers.

    • Lithography circuit board alignment

      Lithography circuit board alignment

      The XY axis stage has a large opening of 200 mm square, allowing circular motion while transmitting light to the glass substrate.

    • Optical mirror high-precision angle adjustment

      Optical mirror high-precision angle adjustment

      The mirror can be fine-tuned in angular resolution on the order of μrad (micro rad), making it optimal for alignment of confocal optics.

  • Precision scanning and mapping measurements

    • CCD pixel shift (pixel shift)

      CCD pixel shift (pixel shift)

      It can also be applied to CCD pixel shifting (pixel displacement) used for high-resolution imaging.

    • Sample tables for microscopes and analytical instruments

      Sample tables for microscopes and analytical instruments

      Suitable for use on sample tables of analytical instruments such as Raman and spectroscopy to obtain high-precision 2D mapping images.

    • Probe microscope, AFM/SPM

      Closed-loop control using a built-in displacement sensor enables more precise image acquisition and accurate movement to the target position compared to a tube scanner.

    • Mapping Measurement

      Ultra-high resolution mapping of small areas by piezo stage and wide range of high precision mapping by piezo motor stage are available.

    • Semiconductor and LCD related equipment

      Alignment marks between devices can be aligned with high precision.

    • Nanometer scanning

      Smooth and reliable scanning operation that follows command signals such as sinusoidal wave and square wave is possible.

  • Objective Lens Focus Applications

    • Microscope High Speed Focus

      Microscope High Speed Focus

      Piezo stages are also suitable for fast AF to follow the undulations of the observation device. Special lenses are also available.

    • Image Processing Application

      Image Processing Application

      Real-time images with a deep depth of focus can be obtained by superimposing slice images acquired with a high-speed camera while moving the objective lens at several tens of Hz.

    • Interference form measurement

      The high resolution of the piezo stage is also suitable for shape measurement using the principle of interference.

    • Semiconductor and FPD inspection equipment

      We offer optimal design using piezoelectric elements to achieve the high precision required by miniaturization and the high speed required by tact time.

    • Laser machining

      Focus adjustment of optical lenses in laser processing is also performed with high speed and high precision.

    • Confocal Microscope

      The mirror can be fine-tuned back and forth in the nm (nanometer) range and angular fine-tuning in the μrad (micro rad) level with high resolution, making it optimal for alignment of confocal optics.

  • Ultra-precision nano machining / high-speed cut machining

    • FTS

      FTS

      Ultra-precision machining is achieved by using a piezo stage for fine cutting of tools for faster machining speeds and higher accuracy.

    • Diamond Turning Tool Precision Feeding

      Diamond Turning Tool Precision Feeding

      It can also be applied to the machining of non-axisymmetric free-form surfaces that accompany the increasing sophistication of optical devices.

    • Precision die machining

      The cutting edge of the tool is precisely aligned with the rotational axis of the workpiece and has the rigidity to maintain a stable posture during machining.

    • Precise positioning of workpieces

      It can also be applied to the continuous and repeated movement of the workpiece and punch press.

  • Various precision positioning applications

    • HDD Tester

      HDD Tester

      The magnetic head can be applied to investigation, analysis, etc. by obtaining a signal of the disk while moving with ultra-high accuracy on the piezo stage.

    • Microscopic specimen tensile, compression

      Microscopic specimen tensile, compression

      Micro specimens are subjected to tension or compression on a piezo stage, which can be applied to acquire data from the elastic range to the plastic range to rupture.

    • High Precision Parallel Surface Alignment

      High Precision Parallel Surface Alignment

      The 2-axis tilting stage enables high-precision plane alignment before pressing.

    • Friction and Wear Test

      Friction and Wear Test

      The piezo stage vibrates the specimen precisely at a fixed period to test the amount of wear on the specimen and the mating material.

  • Detection and measurement of minute forces at the μN (mg) level

    • Micro-pressure load measurement

      Micro-pressure load measurement

      Even minute forces at the μN to mN level can be measured with high sensitivity.

    • Optical fiber and functional devices contact detection

      Optical fiber and functional devices contact detection

      It can also be used as a high-precision touch sensor between devices.

    • Spring Probe Spring Pressure Test Measurement

      Spring Probe Spring Pressure Test Measurement

      It is possible to measure with high sensitivity even springs with small elastic force that are difficult to measure with load cells.

    • Probing contact detection on semiconductor devices

      Probing contact detection on semiconductor devices

      Probing of device electrode surfaces for failure analysis, etc., also captures the moment of contact with high sensitivity.

    • Micro Actuator Thrust Measurement

      It can also be applied to thrust inspection and measurement of small motors and actuators.

    • Tensile and rupture force measurement

      Tensile and rupture forces of minute specimens such as fibers, which are difficult to measure with ordinary testing equipment, can be measured with high sensitivity.

    • Needle tip puncture force into cells

      It measures the puncture force when inserting a needle into a cell, membrane, etc.

    • Micro friction force, thrust monitor

      Force applied during peeling of thin films, etc. can be measured.

  • Highly sensitive force measurement while maintaining high rigidity

    • Workpiece and Diamond Turning Tool Contact Load Measurement

      Workpiece and Diamond Turning Tool Contact Load Measurement

      The cutting force when the bite tip contacts the rotating workpiece can be measured.

    • Frontal Turning Cutting Resistance Measurement

      Frontal Turning Cutting Resistance Measurement

      Detects the force received by the diamond turning tool during the frontal turning process.

    • Cutting and grinding force measurement during precision machining

      The grinding wheel measures the state of surface polishing and makes it possible to determine the state of the machining process.

    • Contact detection between bite cutting edge and workpiece

      Air cutting time in the proximity of the bite cutting edge and the workpiece can be reduced.

    • Pressure and hardness control

      By measuring the reaction force when a certain amount is pressed, it is possible to manage the pressing pressure and reaction force (hardness).

    • Friction force measurement

      Pressure can be monitored during pressing.

    • Thrust and Reaction Monitor

      It is possible to numerically monitor the thrust of the drive source and the resulting reaction force.

  • Equipment/Unit Design Fabrication Examples

    • SAICAS

      SAICAS

      Cuts from the surface to the interior of the material and evaluates the mechanical characteristics of the material based on
      depth and cutting force during the cut.

      • Application Examples

        Resist film, optical film, plating film, ultra-surface layer of polymer materials, etc. 等

      • Equipment Provision

        Daipla Wintes Co., Ltd.

    • Current path imaging equipment

      Current path imaging equipment

      Non-destructive imaging of batteries and electronic devices

      • Application Examples

        ・Identification of abnormalities in the internal electrodes of lithium-ion battery packages
        ・Diagnostic imaging of defective locations on printed circuit boards with complex wiring patterns
        ・Identification of self-discharge locations

      • Equipment Provision

        Integral Geometry Science Inc.